We don't just ship the engines — we run the flow. NoveetyAI couples its physics simulators with commercial and open-source implementation flows, letting autonomous design agents close power, thermal, reliability and mechanical integrity while the design is still moving.
We work on the flow you already have — or stand one up for you.
Production RTL-to-GDSII on the industry-standard flow. We wrap synthesis, floorplanning, place-and-route and sign-off in an agentic orchestration layer, then feed NoveetyAI's extracted-grid analyses — IR-drop, EM/TM lifetime, thermal, warpage — back into the optimization loop.
Fully scriptable, fully open. OpenROAD's headless flow is a natural fit for autonomous exploration — an agent can sweep thousands of implementation candidates and evaluate every one against real physics rather than a surrogate proxy. Ideal for research, academic programs, and cost-sensitive silicon.
Integrity analysis becomes a callable step inside the flow — not a hand-run gate at the end of it.
We start from your RTL, floorplan, chiplet partition, or package stack-up — plus your targets: timing, power, peak junction temperature, IR-drop budget, lifetime, warpage limit.
Implementation runs on a major commercial EDA design flow or OpenROAD, instrumented so that an orchestration agent can drive it end-to-end and extract the power grid, power maps, and geometry it needs at every iteration.
ThermStack, WarpStack, MetalStack and GridStack are invoked through their CLIs on each candidate. Every engine returns machine-readable margins — worst-case droop, time-to-failure, hotspot maps, peak-to-peak bow.
The agent uses those margins to steer the next floorplan, decap plan, stack-up, or material choice — thousands of evaluations where a single sign-off run used to be the whole budget.
Detailed 3D warpage, full-node transient IR-drop, and Monte Carlo lifetime distributions for the chosen candidate — plus the scripts, so your team can rerun the flow itself.
Partition, place and stack chiplets with thermal, warpage and power integrity co-optimized from the first iteration rather than checked at the end.
Transient P/G analysis at full-chip scale, decap budgeting, and dynamic-IR-aware floorplanning driven by GridStack.
Full-chip temperature-aware EM/TM lifetime with Monte Carlo TTF distributions on your extracted grids, via MetalStack.
Static and transient thermal characterization of 2.5D/3D stacks, plus real-time thermal management models fast enough to run inside a control loop.
Screen the design space in 2D, sign off the critical stacks in 3D, and catch solder open / short risk before the assembly line.
Thermal and reliability digital twins of advanced packages and chiplet systems, kept in sync with the physical part across its life.
Whether you need the engines, the flow, or both — we'll scope an engagement around the design you're actually building.
